Samsung Electronics Co., Ltd.
005930.KSpublicSemiconductors & Consumer Electronics
World's largest memory chipmaker (DRAM, NAND) and #2 foundry (Samsung Foundry / SF2). Critical AI infrastructure player: dominant supplier of HBM (High-Bandwidth Memory) alongside SK Hynix, and foundry partner for Qualcomm, NVIDIA (secondary), and Exynos. Investing heavily to close HBM yield gap with SK Hynix.
2024 CAPEX
$35.5B
YoY 2024 vs 2023
-1.4%
Latest Quarter
$9.5B
Q4'25
2025 Guidance
$35.0B–$38.0B
CAPEX History — Quarterly
Guidance Tracker
FY2025
Completed
“We plan to maintain aggressive investment levels in HBM and advanced process nodes. HBM4 qualification is our top priority for 2025.”
Guided: $35.0B–$38.0B
Actual to date: $36.0B
103%
FY2026
On Track
“We will increase CAPEX in 2026 to accelerate HBM4 ramp and advanced DRAM/NAND investment. Foundry recovery and AI memory demand drive investment.”
Guided: $38.0B–$42.0B
Key Quotes
Jun Young-hyun·CEO (Device Solutions)·2025-01-31
“The AI memory market is growing faster than we anticipated. We are accelerating HBM3E and HBM4 production. Samsung will reclaim its leadership position in the AI era.”
Q4 2024 Earnings Call
SEC Filings
koreasemiconductorsHBMDRAMNANDfoundrymemoryAI-chipspublic